ISO 4825-1:2023
This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.
OEN:
ISO
Langue:
English
Code(s) de l'ICS:
81.060.30
Statut:
Publié
Date de Publication:
2023-01-11
Numéro Standard:
ISO 4825-1:2023