IEC 61189-2-804:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.180

Statut:

Publié

Date de Publication:

2023-08-24

Numéro Standard:

IEC 61189-2-804:2023