IEC 62899-202-9:2023

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.180; 87.080

Statut:

Publié

Date de Publication:

2023-08-02

Numéro Standard:

IEC 62899-202-9:2023