IEC 60249-3-1:1981

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.
OEN:
IEC
Langue:
English
Code(s) de l'ICS:
31.180
Statut:
Annulée
Date de Publication:
1980-12-31
Numéro Standard:
IEC 60249-3-1:1981