IEC 60249-3-1:1981

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.180

Statut:

Annulée

Date de Publication:

1980-12-31

Numéro Standard:

IEC 60249-3-1:1981