IEC 61188-1-2:1998

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.180

Statut:

Annulée

Date de Publication:

1998-04-28

Numéro Standard:

IEC 61188-1-2:1998