Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of dis...
IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.
This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.
Normalisation thermique des boîtiers de semiconducteurs - Partie 3: Modèles de simulation de circuit...
L’IEC 63378-3:2025 spécifie le modèle de réseau de circuits thermiques des boîtiers discrets (TO‑243, TO‑252 et TO‑263), qui est utilisé dans l’analyse transitoire des dispositifs électroniques pour estimer avec précision les températures de jonction sans vérification expérimentale.
Ce modèle est destiné à être fabriqué et fourni par les fournisseurs de semiconducteurs, et à être utilisé par les…
Insulation coordination for equipment within low-voltage supply systems - Part 1: Principles, requir...
IEC 60664-1:2020+AMD1:2025 CSV deals with insulation coordination for equipment having a rated voltage up to AC 1 000 V or DC 1 500 V connected to low-voltage supply systems. This document applies to frequencies up to 30 kHz. It applies to equipment for use up to 2 000 m above sea level and provides guidance for use at higher altitudes. It provides requirements for technical committees to…
Lamp caps and holders together with gauges for the control of interchangeability and safety - 12-mon...
The database has been updated following the publication of Amendment 64 to Part 1 and Amendment 60 to Part 2.
It contains the recommendations of the IEC in regard to lamp caps and holders in general use, together with relevant gauges, with the object of securing international interchangeability. The standard consists of four parts. Part 1: Lamp caps, Part 2: Lampholders, Part 3: Gauges, Part 4…
