Organic light emitting diode (OLED) displays - Part 6-1: Measuring methods of optical and electro-op...
IEC 62341-6-1:2025 specifies the standard measurement conditions and measuring methods for determining the optical and electro-optical parameters of organic light emitting diode (OLED) displays. Except for the power consumption method, all methods are intended for unbounded input signals measured in the flat regions of the display in a dark room. This fourth edition cancels and replaces the third…
Organic light emitting diode (OLED) displays - Part 6-1: Measuring methods of optical and electro-op...
IEC 62341-6-1:2025 CMV contains both the official standard and its commented version. The commented version provides you with a quick and easy way to compare all the changes between IEC 62341-6-1:2025 edition 4.0 and the previous IEC 62341-6-1:2022 edition 2.0. Furthermore, comments from IEC TC 110 experts are provided to explain the reasons of the most relevant changes, or to clarify any part of…
Integrating distributed PV into LVDC systems and use cases
IEC TR 63534:2025 reviews existing theoretical attempts and engineering applications in the area of solar PV systems coupled to LVDC systems. There are three aspects that are identified to be highly relevant to standard compilations:
power converters and possible control mechanisms that are eligible for facilitating the interlinking between PV and LVDC networks;
local PV system islanding…
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of dis...
IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.
This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.
Normalisation thermique des boîtiers de semiconducteurs - Partie 3: Modèles de simulation de circuit...
L’IEC 63378-3:2025 spécifie le modèle de réseau de circuits thermiques des boîtiers discrets (TO‑243, TO‑252 et TO‑263), qui est utilisé dans l’analyse transitoire des dispositifs électroniques pour estimer avec précision les températures de jonction sans vérification expérimentale.
Ce modèle est destiné à être fabriqué et fourni par les fournisseurs de semiconducteurs, et à être utilisé par les…
