ISO 9453:2014

Soft solder alloys — Chemical compositions and forms
ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
OEN:
ISO
Langue:
English
Code(s) de l'ICS:
25.160.50
Statut:
Annulée
Date de Publication:
2014-08-17
Numéro Standard:
ISO 9453:2014