ISO 9453:2014

Soft solder alloys — Chemical compositions and forms

ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

OEN:

ISO

Langue:

English

Code(s) de l'ICS:

25.160.50

Statut:

Annulée

Date de Publication:

2014-08-17

Numéro Standard:

ISO 9453:2014