IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.180

Statut:

Publié

Date de Publication:

2023-07-25

Numéro Standard:

IEC 61189-2-803:2023