IEC TR 63378-1:2021

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.080.01

Statut:

Publié

Date de Publication:

2021-12-13

Numéro Standard:

IEC TR 63378-1:2021