IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.180

Statut:

Publié

Date de Publication:

2021-09-02

Numéro Standard:

IEC 61189-2-807:2021