IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.180; 31.190

Statut:

Publié

Date de Publication:

2021-02-22

Numéro Standard:

IEC 61188-6-1:2021