IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
OEN:
IEC
Langue:
English
Code(s) de l'ICS:
31.180; 31.190
Statut:
Publié
Date de Publication:
2021-02-22
Numéro Standard:
IEC 61188-6-1:2021