IEC TR 60286-7:2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.020; 31.240

Statut:

Publié

Date de Publication:

2019-10-13

Numéro Standard:

IEC TR 60286-7:2019