IEC TR 62878-2-7:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.180; 31.190

Statut:

Publié

Date de Publication:

2019-03-19

Numéro Standard:

IEC TR 62878-2-7:2019