IEC PAS 62191:2000

Acoustic microscopy for nonhermetic encapsulated electronic components
Defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. Provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compounds voids, etc.) nondestructively in plastic packages while achieving reproducibility.
OEN:
IEC
Langue:
English
Code(s) de l'ICS:
31.080.01
Statut:
Remplacé
Date de Publication:
2000-11-27
Numéro Standard:
IEC PAS 62191:2000