IEC PAS 62203:2000

Guide for the standard probe pad sizes and layouts for wafer-level electrical testing
Applies to double- and single-column arrays of metal probe pads, on a semiconductor wafer or chip, that are electrically connected to one or more test structures.
OEN:
IEC
Langue:
English
Code(s) de l'ICS:
31.080.01
Statut:
Annulée
Date de Publication:
2000-11-27
Numéro Standard:
IEC PAS 62203:2000