IEC PAS 62170:2000

Bond wire modeling standard

Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers. Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond configuration.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.080.01

Statut:

Annulée

Date de Publication:

2000-08-23

Numéro Standard:

IEC PAS 62170:2000