IEC 60191-4:2013+AMD1:2018 CSV

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition: a) Material code "S" is added to indicate a silicon based package. b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.
OEN:
IEC
Langue:
English
Code(s) de l'ICS:
31.080.01
Statut:
Publié
Date de Publication:
2018-03-26
Numéro Standard:
IEC 60191-4:2013+AMD1:2018 CSV