IEC 62047-16:2015

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.080.99

Statut:

Publié

Date de Publication:

2015-03-04

Numéro Standard:

IEC 62047-16:2015