IEC TR 62866:2014

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.180

Statut:

Publié

Date de Publication:

2014-05-06

Numéro Standard:

IEC TR 62866:2014