IEC 60191-6-10:2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).
OEN:
IEC
Langue:
English
Code(s) de l'ICS:
31.080.01
Statut:
Publié
Date de Publication:
2003-11-18
Numéro Standard:
IEC 60191-6-10:2003