IEC TS 62647-2:2012

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

03.100.50; 31.020; 49.060

Statut:

Publié

Date de Publication:

2012-11-28

Numéro Standard:

IEC TS 62647-2:2012