IEC PAS 60191-6-18:2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.080.01

Statut:

Remplacé

Date de Publication:

2008-01-21

Numéro Standard:

IEC PAS 60191-6-18:2008