IEC 61191-2:1998

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.240

Statut:

Révisé

Date de Publication:

1998-08-27

Numéro Standard:

IEC 61191-2:1998