IEC 60749-22:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.080.01

Statut:

Publié

Date de Publication:

2002-09-11

Numéro Standard:

IEC 60749-22:2002