IEC 60749-20:2002

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.080.01

Statut:

Révisé

Date de Publication:

2002-09-29

Numéro Standard:

IEC 60749-20:2002