IEC 60749-16:2003

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.080.01

Statut:

Publié

Date de Publication:

2003-01-16

Numéro Standard:

IEC 60749-16:2003