IEC 60749-8:2002

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.080.01

Statut:

Publié

Date de Publication:

2002-08-29

Numéro Standard:

IEC 60749-8:2002