IEC 60749-3:2002

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The contents of the corrigendum of August 2003 have been included in this copy.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.080.01

Statut:

Révisé

Date de Publication:

2002-04-08

Numéro Standard:

IEC 60749-3:2002