IEC 60512-6-2:2002

Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump

Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.220.10

Statut:

Publié

Date de Publication:

2002-02-20

Numéro Standard:

IEC 60512-6-2:2002