IEC 60191-6-4:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.080.01

Statut:

Publié

Date de Publication:

2003-06-10

Numéro Standard:

IEC 60191-6-4:2003