IEC 60191-6-4:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
OEN:
IEC
Langue:
English
Code(s) de l'ICS:
31.080.01
Statut:
Publié
Date de Publication:
2003-06-10
Numéro Standard:
IEC 60191-6-4:2003