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This International Standard specifies the mapping functions for a pair of on-demand inter-PINX connections using a circuit mode basic service and the supplementary service User-to-User Signalling (service 3) of a public ISDN at the same time. In order to connect a Private Integrated Services Network Exchange (PINX) to another PINX, mapping functions are required to adapt the specific interfaces…

This International Standard defines the mapping functions in exchanges of Private Integrated Services Networks (PISNs) required for the utilization of scenarios in which 64 kbit/s circuit mode connections are sub-multiplexed into 4 x 16 kbit/s channels for carrying inter-PINX signalling and user information. NOTE 1 - This International Standard has been prepared to meet the specific needs of an…

This International Standard specifies the mapping functions for a pair of on-demand inter-PINX connections using a circuit mode basic service and the supplementary service User-to-User Signalling (service 3) of a public ISDN at the same time. In order to connect a Private Integrated Services Network Exchange (PINX) to another PINX, mapping functions are required to adapt the specific interfaces…

This International Standard defines the mapping functions in exchanges of Private Integrated Services Networks (PISNs) required for the utilization of scenarios in which 64 kbit/s circuit mode connections are sub-multiplexed into 4 x 16 kbit/s channels for carrying inter-PINX signalling and user information. NOTE 1 - This International Standard has been prepared to meet the specific needs of an…

Applies to monolithic microwave GaAs integrated circuits (MMICSs) and their individual component building blocks, such as GaAs field effect transistors (FETs), resistors and capacitors. Aims at estimating the expected lifetime of the devices at operational temperatures; usually the median lifetime (50 % failure) is used for this purpose. The purpose is to define a standard approach for evaluating…

Provides SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. Applicable to all nonhermetic SMDs subjected to bulk solder reflow processes during PCB…

Establishes procedures for notifying semiconductor users of product and process changes made by semiconductor suppliers.

For power GaAs FET applications requiring high reliability an accurate measurement of thermal resistance is extremely important to provide the user with knowledge of the FET's operating temperature so that more accurate life estimates can be made. FET failure mechanism and failure rates have in general, an exponential dependence on temperature.

The home electronic system (HES) provides a common method for interfacing equipment with a variety of home control systems (HCS) such as sensors, actuators, appliances, user interfaces, controllers, switches etc. An HCS is a local area network specialized for residential communications, commonly called home automation. This terminology is applicable to all standards and technical reports dealing…

This Technical Report applies to the removal and destruction of images from microforms when document expungement is ordered. It also applies to the revision of image content when an order requires the deletion, correction or amendment of specific information. It establishes proper procedures for image removal or revision and for documenting these actions to ensure file integrity. These guidelines…