Information technology — Data protocol for radio frequency identification (RFID) for item management...
This document focuses on the abstract interface between an application and the data processor and includes the specification and definition of application commands and responses. It allows data and commands to be specified in a standardised way, independent of the ISO/IEC 18000 series air interfaces.
This document:
— provides guidelines on presenting data as objects;
— defines the structure…
IEC 60038:2009+A1:2021 specifies standard voltage values which are intended to serve as preferential values for the nominal voltage of electrical supply systems, and as reference values for equipment and system design. This seventh constitutes a technical revision. The significant technical changes are:
- the addition of the values of 230 V (50 Hz) and 230/400 V (60 Hz) to Table 1;
- the…
Information technology - Data protocol for radio frequency identification (RFID) for item management...
This document focuses on the abstract interface between an application and the data processor and includes the specification and definition of application commands and responses. It allows data and commands to be specified in a standardised way, independent of the ISO/IEC 18000 series air interfaces.
This document:
— provides guidelines on presenting data as objects;
— defines the structure…
Power quality management - Part 1: General guidelines
IEC TS 63222-1:2021(E), which is a Technical Specification, is intended to provide provisions associated to the main use cases regarding recognized engineering practices applicable to power quality management in public electric power supply networks. It summarizes the operation in power quality management and investigates the current standards, for requirement of power quality assessment work, as…
Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter...
IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.
