Matériel de mise à la terre et de liaison

Scope

1.1 This Standard applies to grounding and bonding equipment for use in accordance with the Canadian Electrical Code, Part I, CSA C22.1, in Canada, the National Electrical Code, NFPA 70, in the United States, or the Standard for Electrical Installations, NOM-001-SEDE, in Mexico.

1.2 This Standard applies to the following grounding and bonding equipment:

a) ground clamps, bonding devices, grounding bushings, water-meter shunts, grounding electrodes, and the like used in a grounding system;

b) equipment for making electrical connections between
 

1. the grounding conductors used in electrical power systems, non-current-carrying metal parts of electrical equipment, armored grounding wires, metal raceways, and the like; and




 
2.  
3. grounding electrodes;

c) equipment for making electrical connections between
 

1. the grounding conductors used in telecommunications systems such as telephone, radio, CATV, network power broadband, and the like; and




 
2.  
3. grounding electrodes;

d) hospital grounding jacks and mating grounding cord assemblies (for Mexico and the United States, see Annex A);

e) bonding devices for making electrical connections between
 

1. the hex head of a brass fitting used in a piping system in accordance with 250.104 of NFPA 70; and




 
2.  
3. the grounding electrodes; and

f) intersystem bonding terminations for connecting intersystem bonding and grounding conductors for other systems in accordance with NFPA 70