Rechercher

IEC 62769-103-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-1_CP 3/1 (PROFIBUS DP)[2] and IEC 61784-1_CP3/2 (PROFIBUS PA). [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products…

L'IEC 62769-103-1:2023 spécifie un profil FDI®[1] de l'IEC 62769 pour le profil de communication CP 3/1 défini dans l'IEC 61784-1 (PROFIBUS DP)[2] et pour le profil de communication CP 3/2 (PROFIBUS PA) défini dans l'IEC 61784-1. [1] FDI est une marque déposée de l’organisation à but non lucratif Fieldbus Foundation, Inc. Cette information est donnée à l'intention des…

This document specifies diagnostic application requirements and OSI-layer related communication profiles to ensure the interchange of digital information between towing and towed vehicles with a maximum authorized total mass greater than 3 500 kg. The conformance and interoperability test plans are not part of this document.

This document specifies the methods relating to the environmental tests of optical instruments including additional assemblies from other fields (e.g. mechanical, chemical, and electronic devices), under equivalent conditions, for their ability to resist the influence of low pressure combined with cold, including the potential condensation and freezing of moisture, ambient temperature, and dry or…

This document specifies a reference method for the determination of volatile organic compound (VOC) emissions into indoor air from floor covering adhesives and products used for flooring installation. This method is applicable to determine volatile organic compounds, semi-volatile organic compounds, and volatile aldehydes. It is based on the use of a test chamber and subsequent analysis of an air…

IEC 62769-101-1:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62769-101-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784‑1_CP 1/1 (Foundation™ Fieldbus H1)[2…

IEC 62769-101-2:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62769-101-2:2023 specifies the IEC 62769 profile for IEC 61784‑1, CP 1/2 (Foundation™ Fieldbus HSE)[1]. [1…

IEC 62769-6-100:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation regarding the components FDI® Client and User Interface Plug-in (UIP) using the Runtime .NET. This runtime is specific only to the WORKSTATION platform as defined in IEC 62769‑4. [1] FDI is a registered trademark…

L'IEC 62769-6-100:2023 spécifie le mapping de technologies pour les concepts décrits dans la norme d'intégration des appareils de terrain (FDI®[1], Field Device Integration). Le mapping de technologies porte essentiellement sur la mise en œuvre des composants Client FDI® et Plugiciel d'interface utilisateur (UIP, User Interface Plug-in) à l'aide de l'environnement d'…

IEC 62386-253:2023 specifies the information related to diagnostics and maintenance information accessible through memory banks. This document builds on the digital addressable lighting interface as specified in the IEC 62386 series, by adding specific requirements for data exchange. The information given for light sources in this document is specific to LED light sources. This document is only…