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This document establishes a generally applicable (i.e. not application specific) definition for dispersibility. It identifies significant characteristics for evaluating dispersibility and lists examples of methods used to characterize dispersibility in various applications. This document applies to processes that disperse powders into a liquid continuous phase while reducing the size of…

IEC 61850-7-420:2021 defines the IEC 61850 information models to be used in the exchange of information with distributed energy resources (DER) and Distribution Automation (DA) systems. DERs include distribution-connected generation systems, energy storage systems, and controllable loads, as well as facility DER management systems, including aggregated DER, such as plant control systems, facility…

IEC 61850-7-420:2021 définit les modèles d'information IEC 61850 à utiliser pour l'échange d'informations avec les systèmes de ressources énergétiques décentralisées (DER) et les systèmes d'automatisation de la distribution (DA). Les DER comprennent les systèmes de production raccordés à la distribution, les systèmes de stockage d'énergie et les charges modulables, ainsi…

Le présent document définit les propriétés qui caractérisent le couplage des ondes lumineuses à l’entrée et la sortie de circuits optiques intégrés (IOC) et de circuits avec circuits photoniques intégrés (PIC). Le présent document se concentre sur le couplage en about par l’intermédiaire des faces des guides d’ondes. Les définitions fournissent la base de spécification des éléments à coupler (par…

This document defines basic terms for integrated optical devices, their related optical chips and optical elements which find applications, for example, in the fields of optical communications and sensors. —    The coordinate system used in Clause 3 is described in Annex A. —    The symbols and units defined in detail in Clause 3 are listed in Annex B.

This document defines the relevant properties for coupling lightwaves into and out of integrated optical chips (IOC) and chips with photonic integrated circuits (PIC). This document mainly focuses on butt coupling via the waveguide endfaces. The definitions provide the basis for specifying the elements to be coupled (e. g. fibres, integrated optical chips) related to coupling properties.

This document defines terms used in the classification of integrated optical elements, integrated optical components and integrated optical devices, which find applications, for example, in the fields of optical communications and sensors.

This document specifies the nominal sizes of photographic glass plates, together with cutting dimensions and their tolerances. It also specifies the nominal substrate thicknesses and their tolerances, as well as providing a cross-reference for sheet films being used in newly manufactured holders for 19th century glass plate cameras.

This document specifies common session layer services and requirements to provide independence between unified diagnostic services (ISO 14229-1) and all transport protocols and network layer services (e.g. ISO 13400-2 DoIP, ISO 15765-2 DoCAN, ISO 10681-2 communication on FlexRay, ISO 14230-2 DoK-Line, and ISO 20794-3 CXPI). This document specifies a common service primitive interface between OSI…

This document specifies requirements for the use, general maintenance and safety of wheels and rims including multi-piece wheels and rims. This document defines their out-of-service conditions, such as cracked, worn and bent wheels and rim components. It is applicable to wheels intended for use on road as defined in ISO 3833 and off road vehicles. This document does not include mopeds and…