Financial services — Financial instrument short name (FISN)
This document specifies rules for an international method for building financial instrument short names (FISNs) for any kind of financial or referential instrument within a defined structure. Financial or referential instruments include, but are not limited to, those described by ISO 10962.
This document is applicable to any application in the trading and administration of financial or…
Additive manufacturing for aerospace — General principles — Part classifications for additive manufa...
1.1 This document is intended to be used to assign part classifications across the aviation industries that use AM to produce parts.
1.2 This document is applicable to all AM technologies defined in ISO/ASTM 52900 used in aviation.
1.3 This document is intended to be used to establish a metric for AM parts in downstream documents.
1.4 This document is not intended to…
Industrial networks - Profiles - Part 5-6: Installation of fieldbuses - Installation profiles for CP...
IEC 61784-5-6:2024 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 61784-5-6:2024 specifies the installation profiles for CPF 6 (INTERBUSTM)[1]. The installation profiles are…
Industrial networks - Profiles - Part 5-8: Installation of fieldbuses - Installation profiles for CP...
IEC 61784-5-8:2024 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 61784-5-8:2024 specifies the installation profiles for CPF 8 (CC-LinkTM[1]). The installation profiles are…
Industrial networks - Profiles - Part 5-19: Installation of fieldbuses - Installation profiles for C...
IEC 61784-5-19:2024 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 61784-5-19:2024 specifies the installation profile for CPF 19 (MECHATROLINKTM[1]). The installation profiles…
Industrial networks - Profiles - Part 5-12: Installation of fieldbuses - Installation profiles for C...
IEC 61784-5-12:2024 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 61784-5-12:2024 specifies the installation profile for CPF 12 (EtherCAT™).
The installation profile is…
Traditional Chinese medicine — Report on the global industry and standardization development of Pana...
This document reports on the global industry and standardization development of Panax ginseng. It includes its origin and application history, medicinal value, geographical distribution, cultivation and processing methods, industry development, international trade, current status and development demands for standardization.
Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC ...
IEC 62453-302:2023 provides information for integrating the CIP™ technology into the FDT interface specification (IEC 62453‑2). Communication Profile Family 2 (commonly known as CIP™[1]) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNet™[2]), CP 2/2 (EtherNet/IP™[3]), and…
Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC ...
IEC 62453-302:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 62453-302:2023 provides information for integrating the CIP™ technology into the FDT interface specification (…
Guidance for use of radiation-sensitive indicators
This document covers procedures for using radiationsensitive indicators (referred to hereafter as indicators) in radiation processing. These indicators may be labels, papers, inks or packaging materials which undergo a visual change when exposed to ionizing radiation (1-5).
The purpose for using indicators is to determine visually whether or not a product has been irradiated, rather than to…