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ISO/TS 10303-1621:2006 specifies the application module for AP210 interconnect requirement allocation. ISO/TS 10303-1621:2006 deals with the representation of interconnect requirement allocation. Interconnect requirement allocation includes the following information: complete functional and physical requirements,complete capability to allocate enterprise or external agency requirements to…

ISO/TS 10303-1620:2006 specifies the application module for AP210 interconnect physical requirements. ISO/TS 10303-1620:2006 deals with the representation of interconnect physical requirements. This data includes all information related to shape and position requirements. Trace, via and other passage spacing,…

ISO/TS 10303-1618:2006 specifies the application module for AP210 interconnect design for microwave. ISO/TS 10303-1618:2006 deals with the representation of interconnect design for microwave. The circuit traces may be considered to be microstrip or stripline, with a specified shape element of the cross-section (i.e. point, edge, cutting plane) acting as the terminal or port of the line or…

ISO/TS 10303-1617:2006 specifies the application module for AP210 interconnect design. ISO/TS 10303-1617:2006 deals with the representation of interconnect design. This data provides functional and physical layout information sufficient to allow manufacture and test of an interconnect. Design re-use is…

ISO/TS 10303-1627:2006 specifies the application module for AP210 printed part functional and physical characterization. ISO/TS 10303-1627:2006 deals with the representation of printed part functional and physical characterization. Printed part data includes following information: device model;layout template data;functional data;environmental constraints;performance data;simulation models.…

ISO/TS 10303-1625:2006 specifies the application module for AP210 packaged part white box model. ISO/TS 10303-1625:2006 specifies an application module for the representation of discrete parts using a white box model for mechanical analysis purposes. ISO/TS 10303-1625:2006 supports the following information: a device model,package data,functional data,environmental constraints,performance data,…

IEC TR 61000-2-14:2006 Describes the electromagnetic environment with respect to the voltages in excess of normal that are found on electricity supply networks operating at low and medium nominal voltages and that can be impressed on equipment connected to those networks, without considering further effects (e.g. amplification or attenuation) within an installation. Since these overvoltages have…

IEC/TR 61000-2-14:2006 décrit l'environnement électromagnétique en ce qui concerne les tensions supérieures aux valeurs normales qui apparaissent dans les réseaux d'alimentation électrique fonctionnant aux tensions nominales basses et moyennes, et dont peuvent faire l'objet les matériels connectés à ces réseaux, sans tenir compte de leurs effets (amplification ou atténuation, par…

ISO/TS 10303-1754:2006 specifies the application module for Via component. The following are within the scope of ISO/TS 10303-1754:2006: blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed; cylinder vias, where the cross-section shape is…

ISO/TS 10303-1755:2006 specifies the application module for Physical connectivity definition. The following are within the scope of ISO/TS 10303-1755:2006: the network representation using physical component terminal identifiers;the lifecycle management of a network representation including make from and requirement…