Low-voltage switchgear and controlgear - Part 2: Circuit-breakers
IEC 60947-2:2006+A1:2009 applies to circuit-breakers, the main contacts of which are intended to be connected to circuits, the rated voltage of which does not exceed 1 000 V a.c. or 1 500 V d.c.; it also contains additional requirements for integrally fused circuit-breakers. The main changes introduced in this new edition are an amendment to the verification of dielectric properties, the…
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specificati...
IEC 61249-4-14:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-36 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specificati...
IEC 61249-4-15:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-35 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specificati...
IEC 61249-4-16:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-37 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specificati...
IEC 61249-4-17:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-38 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specificati...
IEC 61249-4-14:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-36 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specificati...
IEC 61249-4-15:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-35 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specificati...
IEC 61249-4-16:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-37 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specificati...
IEC 61249-4-17:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-38 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Grid connected photovoltaic systems - Minimum requirements for system documentation, commissioning t...
IEC 62446:2009 defines the minimal information and documentation required to be handed over to a customer following the installation of a grid connected PV system. Also describes the minimum commissioning tests, inspection criteria and documentation expected to verify the safe installation and correct operation of the system. Is written for grid connected PV systems only.
