Welding — Quality requirements for heat treatment in connection with welding and allied processes
ISO 17663:2009 provides quality requirements for heat treatment in air or controlled atmospheres carried out in workshops and on site in connection with welding and forming. It applies mainly to ferritic steels, but can be used for other materials, as appropriate.
ISO 17663:2009 provides guidance for manufacturers that perform heat treatment or produce heat-treated products or components. ISO…
Low-voltage switchgear and controlgear - Part 2: Circuit-breakers
IEC 60947-2:2006+A1:2009 applies to circuit-breakers, the main contacts of which are intended to be connected to circuits, the rated voltage of which does not exceed 1 000 V a.c. or 1 500 V d.c.; it also contains additional requirements for integrally fused circuit-breakers. The main changes introduced in this new edition are an amendment to the verification of dielectric properties, the…
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specificati...
IEC 61249-4-14:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-36 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specificati...
IEC 61249-4-15:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-35 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specificati...
IEC 61249-4-16:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-37 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specificati...
IEC 61249-4-17:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-38 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specificati...
IEC 61249-4-14:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-36 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specificati...
IEC 61249-4-15:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-35 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specificati...
IEC 61249-4-16:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-37 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specificati...
IEC 61249-4-17:2009 gives requirements for properties of prepreg that are mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-38 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may also be used to bond other types of laminates.…
