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IEC 60384-21:2019 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included,…

IEC 60384-22:2019 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included,…

IEC 60947-7-4:2019 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60947-7-4:2019 specifies requirements for PCB terminal blocks primarily intended for industrial or similar use…

IEC 60947-7-4:2019 specifies requirements for PCB terminal blocks primarily intended for industrial or similar use. Mounting and fixing on the printed circuit board is made by soldering, press-in or equivalent methods to provide electrical and mechanical connection between copper conductors and the printed circuit board. This document applies to PCB terminal blocks intended to connect copper…

L'IEC 60947-7-4:2018 spécifie les exigences concernant les blocs de jonction pour cartes de circuits imprimés destinés principalement à un usage industriel ou similaire. Le montage et la fixation sur la carte de circuits imprimés s'effectuent par brasage, insertion à force ou par des méthodes équivalentes afin d'assurer une connexion électrique et mécanique entre les conducteurs en…

IEC 60286-3:2019 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps,…

IEC 60947-9-1:2019 covers low-voltage arc quenching devices, hereinafter referred to as AQDs, which are intended to eliminate arc-faults in low-voltage assemblies (typically low-voltage switchgear and controlgear assemblies in accordance with the IEC 61439 series), by creating a lower impedance current path, to cause the arcing current to transfer to the new current path. This new current path is…

IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die…

L'IEC 60286-3:2019 est applicable à la mise en bande des composants électroniques sans fils de sortie ou avec tronçons de sortie destinés à être connectés à des circuits électroniques. Elle fournit uniquement les dimensions essentielles pour la mise en bande des composants destinés aux opérations susmentionnées. Le présent document inclut également des exigences relatives à l'emballage…

IEC 61020-1:2019 specifies the terminology, symbols, test methods and other necessary information to provide consistency in detail specifications for electromechanical switches. This document relates to electromechanical switches intended for use in electrical and electronic appliances. Switches covered by this document: a) are devices which open, close, or change the connection of a circuit by…