Switches for household and similar fixed electrical installations - Part 2-1: Particular requirement...
Applies to electronic switches and to associated electronic
extension units for household and similar fixed electrical
installations either indoors or outdoors.
The contents of the Interpretation sheet 1 of December 2011 have been included in this copy.
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
Plastics — Epoxy resins — Determination of chlorine content — Part 1: Inorganic chlorine
ISO 21627 specifies a direct potentiometric method for the determination of inorganic chlorine in epoxy resins, also called ionic chlorine.
The inorganic chlorine content is expressed in milligrams per kilogram of epoxy resin.
Plastics — Epoxy resins — Determination of chlorine content — Part 2: Easily saponifiable chlorine
ISO 21627-2 specifies a method for the determination of easily saponifiable chlorine in epoxy resins.
The values obtained are indicative of the concentration of easily saponifiable chlorine of chlorohydrin groups in the compounds.
The easily saponifiable chlorine content is the quantity of easily saponifiable chlorine in a given quantity of epoxy resin.
Plastics — Epoxy resins — Determination of chlorine content — Part 3: Total chlorine
ISO 21627-3 specifies a method for the determination of the total chlorine contained in epoxy resins.
The amount of chlorine measured by this method, referred to as total chlorine, includes saponifiable organic chlorine and inorganic chlorine.
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-enca...
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads.
The contents of the corrigendum of August 2003 have been included in this copy.
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-enca...
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
Applicable to semiconductor devices (discrete devices and integrated circuits) and establishes provisions common to all the other parts of the series.
The contents of the corrigendum of August 2003 have been included in this copy.
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.
The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.
