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IEC 62769-103-4:2023 is available as IEC 62769-103-4:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-103-4:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-2_CP 3/4, IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET[2]). [1] FDI is a registered trademark of the non-…

IEC 62769-109-1:2023 is available as IEC 62769-109-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 62769-109-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784‑1_CP 9/1 (HART®)[2] and IEC 61784‑1_CP 9/2 (WirelessHART®)[3]. [1] FDI is a registered trademark of the non-…

IEC 62769-103-1:2023 is available as IEC 62769-103-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-103-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-1_CP 3/1 (PROFIBUS DP)[2] and IEC 61784-1_CP3/2 (PROFIBUS PA). [1] FDI is a registered trademark of the non-…

IEC 62769-101-2:2023 is available as IEC 62769-101-2:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-101-2:2023 specifies the IEC 62769 profile for IEC 61784‑1, CP 1/2 (Foundation™ Fieldbus HSE)[1]. [1] Foundation™ Fieldbus is the trade name of the non-profit consortium Fieldbus…

IEC 62769-101-1:2023 is available as IEC 62769-101-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 62769-101-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784‑1_CP 1/1 (Foundation™ Fieldbus H1)[2]. [1] FDI is a registered trademark of the non-profit organization…

This document defines key terms for postal addressing, postal address components and constraints on their use. Specifically, this document specifies postal address components organized into three hierarchical levels: —    elements, such as organization name or postcode, which have well-defined conceptual meaning and are not themselves made up of subordinate components, though they can be sub-…

IEC 62769-100:2023 is available as IEC 62769-100:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-100:2023 specifies an FDI®[1] profile of IEC 62769 for Generic Protocols. That means that all interfaces are defined and a host can add support for more protocols without changing its…

This document describes information items enabling systematic human-centred design for interactive systems. Some of these information items are elaborated by separate International Standards, named the Common Industry Format (CIF) for usability-related information. This document provides the framework of information items, including definitions and the content for each information item. This…

IEC 62769-6:2023 is available as IEC 62769-6:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI…

IEC 62769-7:2023 is available as IEC 62769-7:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-7:2023 specifies the elements implementing communication capabilities called Communication Devices. The overall FDI®[1] architecture is illustrated in Figure 1. The architectural components…