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IEC 60601-1-9:2007+A1:2013+A2:2020 The objective of this collateral standard is to improve the environmental impact for the entire range of medical electrical equipment, taking into account all stages of the product life cycle: - product specification; - design; - manufacturing; - sales, logistics, installation; - use; - end of life management. This means protecting the environment and…

This document specifies a test method for determining the leaktightness of elastomeric sealing ring type joints for buried thermoplastics non-pressure piping systems. Unless otherwise specified in the referring standard, the tests are carried out at the following basic test pressures: — p1: internal negative air pressure (partial vacuum); — p2: a low internal hydrostatic pressure; —…

IEC 62790:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62790:2020 describes safety requirements, constructional requirements and tests for junction boxes up to 1 500 V DC…

IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more…

IEC 60749-15:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole…

IEC 62541-6:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62541-6:2020 specifies the OPC Unified Architecture (OPC UA) mapping between the security model described in IEC TR…

IEC 62541-4:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62541-4:2020 defines the OPC Unified Architecture (OPC UA) Services. The Services defined are the collection of…

IEC 62541-5:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62541-5:2020 defines the Information Model of the OPC Unified Architecture. The Information Model describes…

IEC 62541-3:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62541-3:2020 defines the OPC Unified Architecture (OPC UA) AddressSpace and its Objects. This document is the OPC…

This document provides guidance on the post-market surveillance process and is intended for use by medical device manufacturers. This post-market surveillance process is consistent with relevant international standards, in particular ISO 13485 and ISO 14971. This document describes a proactive and systematic process that manufacturers can use to collect and analyse appropriate data, to provide…