Process management for avionics - Electronic components capability in operation - Part 1: Temperatur...
IEC TR 62240-1:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC TR 62240-1:2018 is a technical report, which provides information when using semiconductor devices in wider…
General lighting - Light emitting diode (LED) products and related equipment - Terms and definitions
IEC 62504:2014+A1:2018 is of assistance in the common understanding of terms and definitions, relevant for general lighting with LED technology. The terms included are those already available in IEC LED standards or used in manufacturers' literature. This standard provides descriptive terms (like "LED light sources") and measurable terms when modified from IEC 60050-845 (like…
Eclairage général - Produits à diode électroluminescente (LED) et équipements associés - Termes et d...
L'IEC 62504:2014+A1:2018 doit aider à une compréhension partagée des termes et des définitions pertinents concernant l'éclairage général avec la technologie à LED. Les termes inclus sont ceux qui sont déjà disponibles dans les normes IEC relatives aux LED ou utilisés dans les ouvrages de référence des fabricants. La présente norme donne des termes descriptifs (comme "sources…
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture ...
IEC 61760-4:2015+A1:2018 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional…
Technique du montage en surface (SMT) - Partie 4: Classification, emballage, étiquetage et manipulat...
L'IEC 61760-4:2015+A1:2018 spécifie la classification des dispositifs sensibles à l'humidité en niveaux de sensibilité liés à la chaleur de brasage, ainsi que les dispositions relatives à l'emballage, l'étiquetage et la manipulation. La présente partie de l'IEC 61760 étend les méthodes de classification et d'emballage à ces composants lorsque les normes existantes ne…
Communication networks and systems for power utility automation - Part 7-7: Machine-processable form...
IEC TS 61850-7-7:2018(E) specifies a way to model the code components of IEC 61850 data model (e.g., the tables describing logical nodes, common data classes, structured data attributes, and enumerations) in an XML format that can be imported and interpreted by tools. The purpose of this document is limited to the publication of the XML format which should support the data model part of any IEC…
Process management for avionics - Electronic components capability in operation - Part 1: Temperatur...
IEC TR 62240-1:2018 is a technical report, which provides information when using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. The uprating solutions described herein are considered exceptions, when no reasonable alternatives are available; otherwise devices are utilized within the manufacturers’ specifications. This document describes the…