IEC 60191-6-12:2002

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

OEN:

IEC

Langue:

English

Code(s) de l'ICS:

31.080.01

Statut:

Révisé

Date de Publication:

2002-06-13

Numéro Standard:

IEC 60191-6-12:2002