Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests
IEC 60068-3-4:2001 Provides the necessary information to assist in preparing relevant specifications, such as standards for components or equipment, in order to select appropriate tests and test severities for specific products and, in some cases, specific types of application. The object of damp heat tests is to determine the ability of products to withstand the stresses occurring in a high…
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of...
IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
Electrostatics - Part 4-3: Standard test methods for specific applications - Footwear
Describes a test method for determining the electrical resistance of footwear used in the control of electrostatic potential on people. This standard is suitable for use by the manufacturer of footwear as well as the end user. A method for measuring the electrical resistance of footwear alone is described and serves as an acceptance test for new footwear. Insulating footwear is not included…
Fibre optic connector interfaces - Part 6: Type MU connector family
Defines the standard interface dimensions for type MU family of connectors which is a miniature single-position plug characterized by a cylindrical, spring loaded butting ferrule and a push-pull coupling mechanism.
Interfaces de connecteurs pour fibres optiques - Partie 6: Famille de connecteurs de type MU
Defines the standard interface dimensions for type MU family of connectors which is a miniature single-position plug characterized by a cylindrical, spring loaded butting ferrule and a push-pull coupling mechanism.
Environmental testing - Part 3-7: Supporting documentation and guidance - Measurements in temperatur...
Provides a uniform and reproducible method of confirming that temperature test chambers conform to the requirements specified in climatic test procedures of IEC 60068-2-1 and IEC 60068-2-2, when loaded with either heat-dissipating or non heat-dissipating specimens under conditions which take into account air circulation inside the working space of the chamber. This standard is destined primarily…
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of...
IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of...
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
Photography — Determination of ISO safelight conditions
This International Standard specifies the methods for determining the maximum exposure time that a given
sensitized material can receive from a given safelight without affecting the quality of the final image. It also
specifies the records which shall be maintained for the components of a safelight and its operating environment.
Information technology - Telecommunications and information exchange between systems - Corporate tel...
This International Standard specifies signalling interworking between "QSIG" and "H.323" in support of the call transfer
supplementary services within a Corporate telecommunication Network (CN).
"QSIG" is a signalling protocol that operates at the Q reference point between Private Integrated Services eXchanges (PINX)
within a Private Integrated Services Network (PISN…
